《陶瓷真空吸盤》《切割盤》《清洗盤》<陶瓷CHUCK>Ceramic Vacuum Suction Pads, Cutting Disks, Cleaning Plates & Ceramic Chucks
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陶瓷真空吸盤、切割盤、清洗盤與陶瓷 CHUCK
產品介紹
徽亞科技專注開發高性能精密陶瓷零件，提供四大應用解決方案：陶瓷真空吸盤、切割盤、清洗盤與陶瓷 CHUCK，廣泛應用於晶圓搬運、清洗、分割與定位等製程。產品具備高平整度、耐腐蝕、耐高溫、抗靜電與絕緣性。
產品分類與特色
- 陶瓷真空吸盤：高潔淨吸附、不導電或抗靜電可選，適用於晶圓、面板與玻璃吸附。
- 陶瓷切割盤：高剛性與高平整，支援玻璃/晶圓劃切，具耐磨性與抗崩邊能力。
- 陶瓷清洗盤：耐化學性強、可設排液孔或凸點結構，用於濕製程與乾燥旋轉模組。
- 陶瓷 CHUCK：用於吸附定位或熱壓模組，支援真空孔位設計與導電/抗靜電規格。
可選材質
- 氧化鋁（Al₂O₃）
- 氮化鋁（AlN）
- 碳化矽（SiC）
- 一體成型抗靜電陶瓷（非鍍膜）
應用產業
- 半導體晶圓製程
- 光電與面板顯示產線
- 雷射貼合與封裝
- 濕製程清洗設備
Ceramic Vacuum Pads, Cutting Disks, Cleaning Plates & Ceramic Chucks
Product Overview
Huiya Technology delivers four key ceramic solutions for wafer processing: ceramic vacuum pads, cutting disks, cleaning plates, and ceramic chucks. Designed for semiconductor and display industries, they offer high flatness, corrosion resistance, thermal durability, ESD safety, and insulation.
Types & Features
- Ceramic Vacuum Pads: Cleanroom compatible, ESD/insulating optional, used for wafer, panel, and glass handling.
- Ceramic Cutting Disks: High stiffness and flatness, chip-resistant, ideal for wafer or glass dicing platforms.
- Ceramic Cleaning Plates: Chemical-resistant with optional liquid drain holes or bumps, suited for wet cleaning tools.
- Ceramic Chucks: Ideal for vacuum clamping, heating stages, or alignment modules; available in conductive or ESD-safe formats.
Available Materials
- Alumina (Al₂O₃)
- Aluminum Nitride (AlN)
- Silicon Carbide (SiC)
- Bulk-form ESD Ceramic (non-coated)
Industries Served
- Semiconductor wafer fabrication
- Display and panel production
- Laser bonding and packaging
- Wet cleaning process tools
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陶瓷真空吸盤、切割盤、清洗盤與陶瓷 CHUCK
產品介紹
徽亞科技專注開發高性能精密陶瓷零件，提供四大應用解決方案：陶瓷真空吸盤、切割盤、清洗盤與陶瓷 CHUCK，廣泛應用於晶圓搬運、清洗、分割與定位等製程。產品具備高平整度、耐腐蝕、耐高溫、抗靜電與絕緣性。
產品分類與特色
- 陶瓷真空吸盤：高潔淨吸附、不導電或抗靜電可選，適用於晶圓、面板與玻璃吸附。
- 陶瓷切割盤：高剛性與高平整，支援玻璃/晶圓劃切，具耐磨性與抗崩邊能力。
- 陶瓷清洗盤：耐化學性強、可設排液孔或凸點結構，用於濕製程與乾燥旋轉模組。
- 陶瓷 CHUCK：用於吸附定位或熱壓模組，支援真空孔位設計與導電/抗靜電規格。
可選材質
- 氧化鋁（Al₂O₃）
- 氮化鋁（AlN）
- 碳化矽（SiC）
- 一體成型抗靜電陶瓷（非鍍膜）
應用產業
- 半導體晶圓製程
- 光電與面板顯示產線
- 雷射貼合與封裝
- 濕製程清洗設備
Ceramic Vacuum Pads, Cutting Disks, Cleaning Plates & Ceramic Chucks
Product Overview
Huiya Technology delivers four key ceramic solutions for wafer processing: ceramic vacuum pads, cutting disks, cleaning plates, and ceramic chucks. Designed for semiconductor and display industries, they offer high flatness, corrosion resistance, thermal durability, ESD safety, and insulation.
Types & Features
- Ceramic Vacuum Pads: Cleanroom compatible, ESD/insulating optional, used for wafer, panel, and glass handling.
- Ceramic Cutting Disks: High stiffness and flatness, chip-resistant, ideal for wafer or glass dicing platforms.
- Ceramic Cleaning Plates: Chemical-resistant with optional liquid drain holes or bumps, suited for wet cleaning tools.
- Ceramic Chucks: Ideal for vacuum clamping, heating stages, or alignment modules; available in conductive or ESD-safe formats.
Available Materials
- Alumina (Al₂O₃)
- Aluminum Nitride (AlN)
- Silicon Carbide (SiC)
- Bulk-form ESD Ceramic (non-coated)
Industries Served
- Semiconductor wafer fabrication
- Display and panel production
- Laser bonding and packaging
- Wet cleaning process tools
